| 摘要 |
<p>PURPOSE: A semiconductor device having a lead line structure is provided to be capable of increasing wire-bonding density and reducing the size of a manufacturing process completed semiconductor device. CONSTITUTION: A semiconductor device is provided with a semiconductor chip(120) having a plurality of bonding pads(125), a plurality of lead lines(140) located along the peripheral portion of the semiconductor chip, and a plurality of wires(130) for electrically connecting each lead line to the bonding pads. At this time, each bonding pad has a connecting portion for carrying out a wiring process by using the wires. At the time, the connecting portions of each bonding pad have at least two different heights. Preferably, a support part made of epoxy is located between lead lines for fixing each lead line.</p> |
