| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for forming metal wiring, by which a high- definition wiring pattern and electrode pattern can be formed, and to provide a metal wiring board manufactured by the same. SOLUTION: In this method for forming metal wiring, in the state that a metal micelle dispersing liquid 10 dispersing metal micelle 16 consisting of fine metal particles 12 and micellar agent 14 is brought into contact with a photocatalyst layer 26 arranged on the surface of a base body 22 of a substrate 20, the photocatalyst layer 26 is irradiated with light to laminate fine metal particles 12 on the substrate 20 and form metal wiring. A conductive substrate obtained by this method can be applied for a plasma display electrode glass substrate or a metal wiring substrate such as a metal electrode wiring substrate. COPYRIGHT: (C)2004,JPO
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