发明名称 TERMINAL STRUCTURE
摘要 <p><P>PROBLEM TO BE SOLVED: To prevent conduction failure due to corrosion of a copper foil part while restricting the manufacturing cost of a printed circuit board, in a terminal structure wherein a terminal is composed by tightening a screw with a washer attached to the copper foil part formed on the printed circuit board by interposing a wire. <P>SOLUTION: In this terminal structure, the terminal is composed by tightening the screw 13 with the washer 14 attached to the copper foil part 12 formed on the printed circuit board 12 by interposing the wire 16. In a flow process for soldering an electronic component 15 on the printed circuit board by boring multiple through-holes 25, since the conduction failure due to corrosion of the copper foil part is prevented by solder parts 26, sucked by the through-holes, other processes such a solder labeler can be omitted, to reduce the cost. <P>COPYRIGHT: (C)2003,JPO</p>
申请公布号 JP2003272738(A) 申请公布日期 2003.09.26
申请号 JP20020075609 申请日期 2002.03.19
申请人 AIPHONE CO LTD 发明人 NAGAYAMA MUNEHITO
分类号 H05K1/11;H05K7/14;(IPC1-7):H01R12/32 主分类号 H05K1/11
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