| 摘要 |
<p>Polishing equipment, comprising a polishing head (30) having an opened hollow mixing tank (32) on the opposite side of the side thereof where a polishing pad (36) is installed, a slurry feed mechanism (50) for feeding slurry into the mixing tank (32), an additive liquid feed mechanism (60) for feeding additive liquid used by adding to the slurry into the mixing tank (32), and a mixed liquid feed tube (34) extending from the mixing tank (32) into the polishing head (30) and opened to near the rotating center of the polishing pad (36), wherein the slurry fed by the slurry feed mechanism (50) and the additive liquid fed by the additive liquid feed mechanism (60) are fed from the mixed liquid feed tube (34) to the outside of the polishing pad (36) in the mixed state in the mixing tank (32).</p> |
