发明名称 |
Protective envelope for a semiconductor integrated circuit |
摘要 |
A protective envelope, made of a plastics material for enclosing a semiconductor integrated circuit, includes a flattened parallelepiped body having a sidewall formed of first and second portions set to converge toward each other. The envelope also includes a lead frame embedded in the body and bearing the integrated circuit, the lead frame having a section bent to form a baffle plate orientated toward the first sidewall portion. Advantageously, the bent section of the lead frame has a plane end edge extending parallel to the first sidewall portion at a spacing therefrom.
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申请公布号 |
US6593665(B2) |
申请公布日期 |
2003.07.15 |
申请号 |
US20010844506 |
申请日期 |
2001.04.27 |
申请人 |
STMICROELECTRONICS S.R.L. |
发明人 |
TIZIANI ROBERTO;TERZOLI MARZIO |
分类号 |
H01L21/56;H01L23/31;(IPC1-7):H01L23/28 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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