| 摘要 |
PURPOSE: A semiconductor package structure is provided to minimize the size of a semiconductor package by making a bonding area formed on the work surface of a semiconductor die extend to the side surface and the bottom surface of a die. CONSTITUTION: A semiconductor circuit(12) and the bonding area(14) are formed on the work surface(10) of the die(2) in the semiconductor package. The bonding area extends to the side surface of the die. The bonding area further extends to a surface opposite to the work surface. |
