PAD EXPOSED TYPE SEMICONDUCTOR PACKAGE FOR GOOD HEAT RADIATION

摘要

PURPOSE: A pad exposed type semiconductor package for good heat radiation is provided to enhance the efficiency of heat emission by exposing one side of a lead frame, projecting a heat-sink lead to the outside of a package, and forming an extended lead frame wing. CONSTITUTION: A lead frame pad(310) has the first side(310a) and the second side(310b). A pad groove(312) and a swaging portion(311) are formed along an edge of the first side. A semiconductor chip(320) is adhered on the lead frame pad. An inner lead(352) is connected electrically with the semiconductor chip. A wire(340) is used for connecting the semiconductor chip with the inner lead. The first side of the lead frame pad, The semiconductor chip, the inner lead, and the wire are surrounded by a molding agent(360). An outer lead(354) is projected from the molding agent.