发明名称 MODULE PART, CORE SUBSTRATE ELEMENT ASSEMBLY, MULTILAYERED SUBSTRATE, METHOD FOR MANUFACTURING CORE SUBSTRATE ELEMENT ASSEMBLY, METHOD FOR MANUFACTURING MULTILAYERED SUBSTRATE, AND METHOD FOR MANUFACTURING MODULE PART
摘要 <p>PROBLEM TO BE SOLVED: To provide a module part which prevents the deterioration of electrical characteristics due to the absorption of moisture from occurring. SOLUTION: An intermediate layer 70 includes a first layer 20, a second layer 30 and a core layer 10. The core layer 10 is made of a material whose strength is higher than those of the first layer 20 and the second layer 30, and has a reticular structure spreading flat, with the outer periphery 11 of the core layer 10 arranged inside the outer peripheries of the first layer 20 and the second layer 30 and further, is sealed between the first layer 20 and the second layer 30. In addition, an upper side layer 71 is laminated on the upper face of the intermediate layer 70. The lower side layer 72 is laminated on the lower face of the intermediate layer 70. The mounted parts 74 are attached to the upper side layer 71 or the lower side layer 72.</p>
申请公布号 JP2003136623(A) 申请公布日期 2003.05.14
申请号 JP20020194810 申请日期 2002.07.03
申请人 TDK CORP 发明人 TAKATANI MINORU;ENDO TOSHIICHI
分类号 B32B7/02;H01L23/12;H05K1/02;H05K1/03;H05K3/00;H05K3/46;(IPC1-7):B32B7/02 主分类号 B32B7/02
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