发明名称 MOLD CLAMPING DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a highly reliable mold clamping device. SOLUTION: The mold clamping device 2 comprises an upper and a lower platen 12 and 18, a tie-bar 8 for fixing the upper and the lower platen 12 and 18 to each other, and an intermediate platen 4 supported in a vertically movable manner by the tie-bar 8 between both upper and lower platens. In addition, a top force 14 and a bottom force 6 are arranged at the upper and the intermediate platen 12 and 14 respectively, and the lower and the intermediate platen 18 and 4 are connected to each other through a linkage mechanism 20. The linkage mechanism 20 has an upper and a lower link 22 and 24 which are connected in a freely rotating manner to each other through a connecting shaft 32. The upper and the lower link 22 and 24 are supported in a freely rotating manner by shafts 28 and 30 fixed to the intermediate and the lower platen 4 and 18 respectively. The connecting shaft 32 is driven by a drive mechanism so that the linkage mechanism 20 is opened/closed, and thus the lower platen 18 is relatively moved up and down to the intermediate platen 4. A radial needle bearing and a thrust bearing are mounted on the connecting shaft 32 and the shafts 28 and 30.
申请公布号 JP2003127197(A) 申请公布日期 2003.05.08
申请号 JP20010324886 申请日期 2001.10.23
申请人 MITSUBISHI ELECTRIC CORP;MITSUBISHI ELECTRIC ENGINEERING CO LTD 发明人 HARADA HIROYOSHI;MATSUO ITARU;IKEGAMI TAKEHIKO;YAMADA HIROMICHI;SAKAKIBARA JUNJI;TAGAMI KEIMEI
分类号 B29C45/66;(IPC1-7):B29C45/66 主分类号 B29C45/66
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