发明名称 MODULE COMPONENT AND MULTILAYER SUBSTRATE FOR MODULE COMPONENT
摘要 PROBLEM TO BE SOLVED: To provide a module component having high reliability without moisture absorbability. SOLUTION: A core layer 70 is made of an inorganic material or an organic material or a composite of materials. An upper side layer 71 is a layer containing an organic component, and is laminated on the upper surface of the layer 70. A lower side layer 72 is a layer containing an organic component and is laminated on the lower surface of the layer 70. The layer 70, the layer 71 and the layer 72 constitute the same end face at side end faces. A component 74 to be installed is installed on the layer 71 or the layer 72.
申请公布号 JP2003086942(A) 申请公布日期 2003.03.20
申请号 JP20010273878 申请日期 2001.09.10
申请人 TDK CORP 发明人 TAKATANI MINORU;ENDO TOSHIICHI
分类号 H05K3/46;H01L23/12;H01L23/14;H01L23/15;H01L25/00;(IPC1-7):H05K3/46 主分类号 H05K3/46
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