发明名称 SUBSTRATE FOR PACKAGING SEMICONDUCTOR DEVICE AND PACKAGE FOR HOUSING OPTICAL SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve a problem that transmission characteristics are deteriorated by making characteristic impedance discontinuous and increasing the reflection of high frequency signal, since a ground potential is made unstable by the conduction resistance and impedance component of a through conductor for connecting an electrode pad and a semiconductor device in a high frequency range of >=20 GHz. SOLUTION: An interval between an electrode pad 13 and each of inner layer ground conductors 10 and 11 are defined as (d) and the diameter of the electrode pad 13 is defined as (w), in the direction parallel to the principal surface of an insulated substrate 9 configured by laminating a plurality of insulating layers 9a, 9b and 9c and an interval between the electrode pad 13 and each of inner layer ground conductors 10' and 11'. The status of 0<d<=w is provided, two of inner layer ground conductors 10, 11, 10' and 11' are laminated through the insulating layer 9b, and the thickness 14 of the insulating layer 9b between each of inner layer ground conductors 10 and 11 and each of inner layer ground conductors 10' and 11' is <=1/4 the wavelength of a high frequency signal to be transmitted by a through conductor 12.
申请公布号 JP2003078065(A) 申请公布日期 2003.03.14
申请号 JP20010270208 申请日期 2001.09.06
申请人 KYOCERA CORP 发明人 YANAGISAWA MITSUO;WADA HISAYOSHI;SHIRASAKI TAKAYUKI
分类号 H01L23/12;(IPC1-7):H01L23/12 主分类号 H01L23/12
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