发明名称 |
Automatic analyzing/controlling device for electroless composite plating solution |
摘要 |
An automatic analysis and control system for electroless composite plating solution for automatically analyzing an electroless composite plating solution and performing such a control as to obtain an appropriate bath composition and/or use conditions, wherein, as a technique for measuring the concentration of a metallic component in the plating solution by absorptiometry, the system includes a mechanism for measuring transmissivity or absorbance at least two or more different wavelengths after the plating solution is automatically introduced into an analytical cell, and a mechanism for calculating the objective concentration from the measured values and displaying the calculation results.
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申请公布号 |
US2003049169(A1) |
申请公布日期 |
2003.03.13 |
申请号 |
US20020031461 |
申请日期 |
2002.01.22 |
申请人 |
CHIBA TADASHI;MONDEN KOJI;YOSHIKAWA KAZUKI;TACHIBANA SHINJI |
发明人 |
CHIBA TADASHI;MONDEN KOJI;YOSHIKAWA KAZUKI;TACHIBANA SHINJI |
分类号 |
C23C18/16;G01N21/31;(IPC1-7):G01N35/00 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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