| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer-cleaning apparatus capable of cleaning a wafer with a sufficient purity. SOLUTION: A cleaning agent supply nozzle 301 comprises a gas discharge part connected to a line 302 for conducting compressed air; a solution discharge part connected to a line 311 for supplying pure water; and a pure water heating mechanism 400 for heating the pure water which passes through the line 311. The tip end part of the solution discharge part is disposed inside an air stream, discharged from the gas discharge part beneath the gas discharge part. Therefore, heated pure water discharged from the solution discharge part is promptly converted into droplets by a jet stream of a surrounding air at a position, immediately below the pure water discharge part. An atomized cleaning agent constituted by droplets of the pure water and an air is supplied to a wafer W, which rotates while being supported by a spin chuck 111.
|
