发明名称 CONTACT PROBE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide one or more contact probes, having semispherical contact bumps having a height of not less than 1/4 of the diameter each, and to provide its manufacturing method which efficiently forms the bumps in an easy way at a low cost. SOLUTION: One or more contact probes, having semispherical contact bumps 5 each having a height of not less than 1/4 of the diameter are provided to allow the pitch of the bumps 6 to be narrowed, as compared with the conventional bumps 5 each having a height of not greater than 1/4 of the diameter.
申请公布号 JP2003057265(A) 申请公布日期 2003.02.26
申请号 JP20010241558 申请日期 2001.08.09
申请人 RICOH CO LTD 发明人 KOBAYASHI HIROSHI
分类号 G01R31/26;G01R1/073;H01L21/66;(IPC1-7):G01R1/073 主分类号 G01R31/26
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