发明名称 |
SPUTTERING DEVICE, METHOD FOR MANUFACTURING ORGANIC EL ELEMENT PANEL USING THE SAME, AND ORGANIC EL ELEMENT |
摘要 |
PROBLEM TO BE SOLVED: To form an electrode by a sputtering method without damaging an organic layer. SOLUTION: This sputtering device is provided with a substrate holder for supporting a substrate; a target holder for supporting a target opposedly to the supported substrate; and a mask provided between the substrate holder and the target holder. The mask has a plurality of first apertures provided on the target holder side; a plurality of second apertures provided on the substrate holder side; and a plurality of passages for communicating the first apertures and second apertures. Each passage is bent so as not to get an unobstructed view of the second aperture from the first aperture.
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申请公布号 |
JP2003031363(A) |
申请公布日期 |
2003.01.31 |
申请号 |
JP20010215539 |
申请日期 |
2001.07.16 |
申请人 |
SHARP CORP |
发明人 |
OGURA TAKASHI |
分类号 |
H05B33/10;C23C14/34;G09F9/00;G09F9/30;H01L27/32;H01L51/50;H05B33/14;H05B33/28;(IPC1-7):H05B33/10 |
主分类号 |
H05B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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