发明名称 SPUTTERING DEVICE, METHOD FOR MANUFACTURING ORGANIC EL ELEMENT PANEL USING THE SAME, AND ORGANIC EL ELEMENT
摘要 PROBLEM TO BE SOLVED: To form an electrode by a sputtering method without damaging an organic layer. SOLUTION: This sputtering device is provided with a substrate holder for supporting a substrate; a target holder for supporting a target opposedly to the supported substrate; and a mask provided between the substrate holder and the target holder. The mask has a plurality of first apertures provided on the target holder side; a plurality of second apertures provided on the substrate holder side; and a plurality of passages for communicating the first apertures and second apertures. Each passage is bent so as not to get an unobstructed view of the second aperture from the first aperture.
申请公布号 JP2003031363(A) 申请公布日期 2003.01.31
申请号 JP20010215539 申请日期 2001.07.16
申请人 SHARP CORP 发明人 OGURA TAKASHI
分类号 H05B33/10;C23C14/34;G09F9/00;G09F9/30;H01L27/32;H01L51/50;H05B33/14;H05B33/28;(IPC1-7):H05B33/10 主分类号 H05B33/10
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