发明名称 |
Method of grinding semiconductor articles |
摘要 |
Disclosed is a method of grinding semiconductor articles comprising the steps of: dicing a semiconductor wafer having bumps formed on one surface into individual chips or pellets; putting the pellets on a printed-wiring board with their flat, bump-less surfaces up; bonding the bumps of the pellets to the electrodes of the printed-wiring board; and grinding the flat, bump-less surfaces of the pellets simultaneously so that they may have a predetermined reduced thickness. The grinding post bonding has the advantageous effect of preventing pellets from being broken or fractured. <IMAGE> |
申请公布号 |
EP0985494(A3) |
申请公布日期 |
2003.01.22 |
申请号 |
EP19990116116 |
申请日期 |
1999.08.18 |
申请人 |
DISCO CORPORATION |
发明人 |
KANEDA, YUKIHIRO;TAKIZAWA, SHUICHI |
分类号 |
B24B7/22;H01L21/304;H01L21/78 |
主分类号 |
B24B7/22 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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