Flat-type semiconductor stack

摘要

In a flat-type semiconductor stack formed by alternately stacking flat-type semiconductor devices (1) and heat-radiating elements (2), a projecting pin (7) is provided on a contact surface of at least one flat-type semiconductor device (1) while a positioning recess (8a) and a guide groove (8) are formed in a contact surface of at least one heat-radiating element (2), the guide groove (8) extending directly from the positioning recess (8a) to a side surface of the heat-radiating element (2). The flat-type semiconductor device (1) is aligned with the heat-radiating element (2) by fitting the pin (7) in the guide groove (8) and sliding the pin (7) along the guide groove (8) until the pin (7) stops to slide at the positioning recess (8a).