发明名称 POLISHING APPARATUS AND DRESSING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a polishing apparatus which can stably supply free abrasive grain to the polishing surfaces of fixed abrasive grains without the problem of the falling of diamond grains on the polishing surface, and then can polish a substrate at a stabler polishing speed by using the fixed abrasive grains, and to provide a dressing method for the fixed abrasive grains. SOLUTION: The polishing apparatus for the substrate which polishes the object substrate to be polished by pressing the object substrate against the fixed grains and sliding it is equipped with a light source 31 which dresses the fixed abrasive grains 13 by light irradiation, and a supply apparatus 41 for chemicals or liquid chemicals accelerating the self-generation of the abrasive grains in the dressing by the light irradiation. The chemicals or liquid chemicals are supplied to the surfaces of the adhesive grains to accelerate or maintain the addressing effect by light.
申请公布号 JP2002324771(A) 申请公布日期 2002.11.08
申请号 JP20020043812 申请日期 2002.02.20
申请人 EBARA CORP 发明人 HIROKAWA KAZUTO;KODERA AKIRA;HIYAMA HIROKUNI
分类号 B24B53/00;B24B53/02;C09K3/14;H01L21/304 主分类号 B24B53/00
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