发明名称 |
Electrothermal integrator and audio frequency filter |
摘要 |
An electrothermal integrator and audio frequency filter utilizing an electrothermal structure fabricated by way of a micro-machining process. An electrothermal structure is a structure in which there is thermal interaction between its electrical components. It is possible to implement an audio frequency filter by properly integrating electrothermal structures fabricated by micro-machining technology and electrical circuitry, because thermal response is generally slower than electrical response. It is possible to implement a variety of filters by way of forming a Gm-C integrator utilizing an electrothermal structure and using this basic block of Gm-C integrator in general circuitry to form filters.
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申请公布号 |
US6462614(B2) |
申请公布日期 |
2002.10.08 |
申请号 |
US20010766839 |
申请日期 |
2001.01.23 |
申请人 |
KOREA ADVANCED INSTITUTE OF SCIENCE & TECHNOLOGY |
发明人 |
YOON EUISIK;LEE KWANG HYUN;LEE HYUNG KEW |
分类号 |
H03H9/00;G01F1/684;G01F1/696;H03H11/04;(IPC1-7):H03B1/00 |
主分类号 |
H03H9/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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