| 摘要 |
PROBLEM TO BE SOLVED: To mount two or more semiconductor elements, havings bumps of different bump pitches, on a semiconductor-mounting substrate. SOLUTION: A semiconductor-mounting substrate 3 has connecting electrodes 1 (1a, 1b, 1c, 1d, 1e). Any one of them is a connecting electrode 1a, 1b, 1c, 1d, 1e having a size sufficient to cover the range, from the position of the bump of the semiconductor element which has the narrowest bump pitch to that of the semiconductor element which has the widest bump pitch among two or more semiconductor elements IC1, IC2 which have bumps of difference bump pitch p.
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