PACKAGING TOOLS AND METHOD FOR SEMICONDUCTOR CARRIER TAPE

摘要

A jig for correcting deformation in a semiconductor carrier tape in which an IC chip and a circuit are packaged and which is cut to a predetermined length. The jig includes a first member flat in a longitudinal direction and curved in a width direction and having a rectangular concave face, and a second member having a rectangular convex face to be fitted with the rectangular concave face of the first member. Dimensions and areas of the rectangular concave face and the rectangular convex face are similar to or substantially similar to those of a main surface of the semiconductor carrier tape, and the warp amounts of the curves of the rectangular concave face and the rectangular convex face are within a range of an allowable warp amount of semiconductor carrier tape.