| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-resistant pressure-sensitive adhesive tape which can control the oxidation, at a time of heating, of a terminal area where masking is applied, to minimize the amount of adhesion of a pressure-sensitive adhesive and the like, thus making the succeeding steps advantageous, a lead frame laminate in which the adhesive tape is used, and a method of manufacturing a semiconductor device. SOLUTION: When a semiconductor chip is sealed with a resin, the heat- resistant pressure-sensitive adhesive tape is used to mask the terminal area by applying it to the area, and the tape is provided with a base material layer comprising a metallic foil and an adherent layer. |
