发明名称 Plasma treatment method and apparatus
摘要 Claimed and disclosed is a treatment apparatus for treating a substrate under decompressed atmosphere, comprising: a chamber, an exhausting means for exhausting the chamber, a first electrode provided in the chamber on which the substrate is mounted or held, a second electrode provided in the chamber opposing the first electrode, a liquid supply source containing a liquid material from which a process gas is generated, a housing provided between the liquid supply source and the chamber to be communicated to the liquid supply source and the chamber, a porous heating unit arranged in the housing for generating the process gas by heating the liquid material supplied from the liquid supply source into the housing in order to vaporize the liquid material, a process gas introduction section provided between the housing and the chamber for guiding the process gas from the housing to the chamber and vibrators to vibrate the porous heating unit. The porous heating unit which is capable of generating heat for itself has an element for electrically heating the porous heating unit. This porous heating unit is arranged in the housing for generating the process gas by heating the liquid material supplied from the liquid supply source into the housing in order to vaporize the liquid material. The treatment apparatus further comprises a process gas introduction section disposed between the housing and the chamber for guiding the process gas from the housing to the chamber.
申请公布号 US6431115(B2) 申请公布日期 2002.08.13
申请号 US20010863860 申请日期 2001.05.23
申请人 TOKYO ELECTRON LIMITED 发明人 KOMINO MITSUAKI;SAKAMOTO YOSHIO
分类号 C23C16/44;C23C16/448;C23C16/455;C23C16/509;C23C16/517;H01J37/32;(IPC1-7):C23C16/00;H05H1/00 主分类号 C23C16/44
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