发明名称 MOLD METHOD FOR SUPERCONDUCTIVE JOINT FABRICATION
摘要 A method for joining multifilamentary superconductive wire comprises disposing the ends of the wires in a hot liquid metal stripping bath for removal of the metal matrix. In particular, in the present invention the ends of the wires to be joined are agitated within this bath to assure complete removal of the metal matrix. The liberated superconductive filaments are then disposed in a solder bath and then inserted into a mold which is filled with hot liquid superconductive solder which is allowed to solidify around the filamentary conductors after which the mold is removed.
申请公布号 IL77120(A) 申请公布日期 1987.10.30
申请号 IL19850077120 申请日期 1985.11.21
申请人 GENERAL ELECTRIC COMPANY 发明人
分类号 H01R43/02;H01L39/02;H01R4/68;(IPC1-7):B23K1/08 主分类号 H01R43/02
代理机构 代理人
主权项
地址