| 摘要 |
PROBLEM TO BE SOLVED: To provide a multichip semiconductor device with deterioration of connection between substrates restrained, in which the substrates mounting components are laminated. SOLUTION: Electronic components 3-5 are mounted on a first substrate 1 and a second substrate 2, which are laminated with spacers 20 having leads 22 between them. Lands 1b, 2b for connection which are formed on a surface of the first substrate 1 and the back of the second substrate 2 are electrically connected via the leads 22. The leads 22 have elasticity so as to be able to bend by the thermal stress generated between the first substrate 1 and the second substrate 2.
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