| 摘要 |
PROBLEM TO BE SOLVED: To perform stripping of a wafer automatically and surely, in a short time. SOLUTION: The wafer-polishing apparatus comprises a polishing head 2, having an annular retainer 10 for supporting a wafer W from the outer circumference thereof and holding the wafer by the surface tension of liquid supplied to the rear surface of the wafer, a means for polishing the surface of the wafer W held by the polishing head 2, and an apparatus 1 for stripping the wafer W from the polishing head 2, after polishing of the wafer is ended. The annular retainer 10 has a cut 11, made in the inner circumferential surface thereof and the stripping apparatus 1 comprises a stripping base 3, having a bank part 4 abutting against the retainer at the circumferential edge, a groove 5 made at a position which faces the retainer 10, where the distance to the inner circumferential edge 4a of the bank is shorter than the distance to the outer circumferential edge 4b thereof, while closing the opposite ends 5a, and an opening 6 for ejecting liquid from the inside of the groove 5 to the retainer 10. |
