Form-in-place gasket for electronic applications

摘要

A non-silicone, form-in-place gasket produced using automated placement followed by curing of a pattern of an extrudable thixotropic material comprising a liquid polyolefin oligomer a reactive diluent a thixotropic filler and a curative. The form-in-place gasket, after curing, has a compression set of about 7% to about 20%, a level of outgassing components of about 10 mug/g to about 45 mug/g and a Shore A hardness from about 45 to about 65.