| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor optoelectronic device in which chipping of die can be prevented effectively, wear and damage of a cutting tool can be reduced greatly, and the yield of dicing process can be enhanced. SOLUTION: In a wafer having a hexagonal system or zinc blend crystal structure, multiple semiconductor optoelectronic devices are formed in an array of nonrectangular dies. When a (0001) hexagonal system wafer is used, respective edges of the dies are arranged along 10-10} plane. When a wafer having (111) zinc blend crystal structure is used, respective edges of the dies are arranged along 1-10} plane. By such an arrangement, each internal angle of the die is set at 60 deg. or 120 deg.. Since all edges of a die are drawn along easily separable similar crystal faces during dicing process, the wafer can be diced well into dies by means of the cutting tool. |
