PATTERN FORMING METHOD AND METAL PATTERN MEMBER

摘要

PROBLEM TO BE SOLVED: To form a metal pattern into an accurate shape, related to a method where a photosensitized plating resist is coated on the surface of a circuit board after a catalyst layer is formed, which is exposed into a prescribed pattern and then developed, and the patterned plating resist is used for a metal pattern by electroless plating. SOLUTION: Since the catalyst layer absorbs the light ray of specific wavelength which cures the plating resist, the light ray hitting the plating resist does not cause halation at the interface with the catalyst layer and the plating resist is patterned into an accurate shape capable of forming a metal pattern into an accurate shape.