SEMICONDUCTOR PACKAGE

摘要

PURPOSE: A semiconductor package is provided to reduce a thickness of the semiconductor package and reduce a damage of a wire in a wire bonding process by improving a structure of the semiconductor package. CONSTITUTION: A bonding pad is formed on a bottom face of an upper chip(12). The bonding pad is formed on an upper face of a lower chip(14). A via hole(16) is formed on an edge portion of the lower chip(14). A conductive bump(18) is formed between the bonding pad of the upper chip(12) and the bonding pad of the lower chip(14). An output terminal(20) is adhered to the via hole(16) exposed toward a bottom edge portion of the lower chip(14). The upper chip(12) is adhered on the lower chip(14). The bonding pad of the lower chip(14) is combined with the bonding pad of the upper chip(12) by using the conductive bump(18).