| 摘要 |
A case for an integrated-circuit mounted on a substrate provides electrical conducting contacts between the integrated circuit and contact elements on an external circuit, e.g., a printed circuit, connected to the case. The case includes contact pins and planar contact leads have free ends that are electrically connected by pressure, without bonding, to corresponding contact areas on the substrate. The substrate carries leads connecting the substrate contact areas with the integrated circuit contacts. At least some of the planar contact leads are configured as a lead structure having a predetermined impedance.
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