发明名称 |
Front-and-back electrically conductive substrate and method for manufacturing same |
摘要 |
A front-and-back electrically conductive substrate includes a plurality of posts composed of a material that can be anisotropically etched and having an electrically conductive portion that has at least a first surface and a second surface that communicate with each other, and an insulative substrate that supports the plurality of posts.
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申请公布号 |
US2002027022(A1) |
申请公布日期 |
2002.03.07 |
申请号 |
US20010783598 |
申请日期 |
2001.02.15 |
申请人 |
FUJITSU LIMITED |
发明人 |
MORIIZUMI KIYOKAZU |
分类号 |
H01L21/48;H01L23/12;H01L23/15;H01L23/48;H01L23/498;H05K1/02;H05K1/11;H05K3/06;H05K3/40;H05K3/46;(IPC1-7):H05K1/11;H05K1/00 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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