| 摘要 |
PROBLEM TO BE SOLVED: To prevent breakage or soldering cracks of a lead terminal even when pressure is applied on the lead terminal such as a microcomputer soldered on a printed board through a heat conduction sheet from a heat sink when the pressure is applied by a pressure machine from upward of the heat sink for adhering between the heat sink and the printed board. SOLUTION: In the heat sink 10 for the microcomputer 3 being a heat generating element, a projection part 6 projected into a round shape is provided on the adhesion face of the microcomputer 3, and the edge of the projection part 6 is contacted on the microcomputer 3.
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