Center bond flip-chip semiconductor device and method of making it

摘要

A center bond flip-chip device carrier and a method for making and using it are described. The carrier includes a flexible substrate supporting a layer of conductive material and a layer of elastomeric material. At least one pocket is formed in the layer of elastomeric material and sized and shaped to house a solder ball. The solder ball is electrically connected to a die positioned on the layer of elastomeric material and also electrically connected to the layer of conductive material.