| 摘要 |
<p>A hard mask 105 of SiCN is formed on a fluorine-containing carbon film 103. Thus, the adhesion of the hard mask 105 to the fluorine-containing carbon 103 is improved and inhibited from being peeled off. The hard mask 105 of SiCN can have a higher etch-selectivity than those of conventional hard masks, and can have a lower dielectric constant than that of SiN or SiC. <IMAGE></p> |
