HEATING CHUCK OF WAFER ASHING EQUIPMENT

摘要

PURPOSE: A heating chuck of wafer ashing equipment is provided to effectively eliminate polymer exposed to plasma and adhered to a wafer in an etching process, by forming a circular groove in the heating chuck used in a conventional ashing process. CONSTITUTION: A heating chuck(300) for an ashing process is formed in semiconductor manufacturing equipment having a groove of a straight line type. A circular groove(340) is formed in an edge portion of the heating chuck. A wafer(10) is exposed to plasma in an etching process so that the circular groove formed in the heating chuck contacts a portion to which polymer is adhered.