WAFER EDGE POLISHING DEVICE AND WAFER EDGE POLISHING METHOD

摘要

PROBLEM TO BE SOLVED: To enhance a yield by preventing a generation of a crack and chipping of a wafer by enhancing a surface roughness of an outer periphery surface of the wafer. SOLUTION: The wafer edge polishing device 1 of this invention is a device for polishing an outer periphery edge surface of a wafer 2 having a crystal azimuth indication part. The device has a work setting part 3 for setting the wafer 2 in the state that the crystal azimuth indication part is coincident therewith which makes the wafer 2 rotatable around an axis; a polishing brush 4 of which the axis is parallel to a stacked direction of the stacked wafers 20 and which is facing to an outer periphery of the stacked wafer 20; a brush rotation driving part 5 for rotating the polishing brush 4 around the axis; a brush reciprocation motion driving part 6 for axially reciprocating the polishing brush 4; a brush follow-up driving part 7 for pressing the polishing brush 4 on an outer periphery surface of the stacked wafer 20 while following the polishing brush 4 to an outer periphery shape of the stacked wafer 20.