发明名称 Adaptive Multidimensional model for general electrical interconnection structures by optimizing orthogonal expansion parameters
摘要 A method for modeling a general passive interconnection structure for use in a circuit simulator. The model is based on full-wave EM simulations and has a predefined accuracy when compared to the full-wave EM simulator. The interconnection structure is described by parameters that depend on geometric parameters determined by a vector x and the frequency of the signal passing through the interconnect circuit. In a CAD system according to the present invention, information representing a plurality of coefficients, Cm(f) is stored in the CAD system for m=0 to M. The CAD system also stores information specifying the values of a plurality of multinomial functions, Pm(x) for m=0 to M, wherein M>1. When the CAD system needs the value of one of the parameters that describes the interconnect circuit, the CAD system computes an approximation, M(f,x), to that parameter according to the relationship:wherein each Pm(x) is a multinomial for m>0. The algorithm combines three adaptive loops. The first adaptive loop selects the required data points by evaluating a number of selection criteria. The number of data points needed to achieve the desired accuracy for the model is minimized. The selected scattering parameters at the data points are calculated using, the full-wave EM simulator. The second adaptive loop selects the frequency points needed by the simulator to accurately model the behavior of the scattering parameters over the whole frequency range. The third adaptive loop selects the number of polynomials needed to accurately model the data points. The resulting model has a predefined accuracy when compared to full-wave EM simulations.
申请公布号 US6295635(B1) 申请公布日期 2001.09.25
申请号 US19980193296 申请日期 1998.11.17
申请人 AGILENT TECHNOLOGIES, INC. 发明人 DHAENE TOM;DE GEEST JAN
分类号 H01L21/82;G01R31/28;G06F17/50;(IPC1-7):G06F17/50 主分类号 H01L21/82
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