| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition having superior adhesion to a glass substrate, superior developability, heat and solvent resistances and also having stability in long-term storage. SOLUTION: The photosensitive resin composition contains a carboxyl- containing organic binder (A) having a specified molecular weight distribution, an ethylenic unsaturated group-containing compound (B), a photoinitiator (C) consisting of an acetophenone compound and a biimidazole compound, an organic solvent (D) and a pigment (E). |
