发明名称 Shielded PC card packages
摘要 A PCB package for shielding electromagnetic radiation from exiting or entering the package. In one embodiment the package includes first and second electrically conductive covers and first and second electrically conductive frames. The first frame electrically connected to the first cover and the second frame electrically connected to the second cover. The first frame is then electrically connected to the second frame. The first and second frames can be made of electrically conductive plastics or metals or any other electrically conductive materials. Methods of assembling the packages of the various embodiments are also set forth.
申请公布号 US2001019475(A1) 申请公布日期 2001.09.06
申请号 US20010804670 申请日期 2001.03.13
申请人 METHODE ELECTRONICS, INC. 发明人 KIMURA RYAN;FARQUHAR JAMES;ALLEN JEFFREY;CHAO MICHAEL;HATCH STEPHEN;HERBERT SCOTT;WEIBEZHAN BRANDT;FAJARDO IGGON
分类号 H05K5/02;(IPC1-7):H05K5/00;H05K5/04;H05K5/06 主分类号 H05K5/02
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