| 摘要 |
PROBLEM TO BE SOLVED: To obtain an easy soldering device which feeds the best amount of solder for soldering. SOLUTION: This device is equipped with a supply mechanism 20 having a hole which supplies a piece of solder 15 at a time, a gripper 40 which grips the flank of solder 15 supplied by the supply mechanism 20 and is movable along X, Y, and Z axes, a camera 50 for a lead wire 1L of an electronic component 1 which picks up an image of the tip of the lead wire 1L while the lead wire 1L is inserted faceup into a hole of the printed board 3, an image processing part 110 which finds the coordinate values of the tip of the lead wire 1L according to image pickup information obtained by the camera 50, and a control part 110 which operates the gripper 40 according to the coordinate values found by the image processing part 110 to put the lead wire 1L in the hole of the solder 15.
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