发明名称 RESIN COMPOSITION AND USE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a resin composition excellent in molding processability and flexibility, and to provide molded products and laminates each using the above resin composition. SOLUTION: This resin composition comprises (A) a thermoplastic resin and (B) an ethylene-vinyl acetate copolymer 40-65 wt.% in vinyl acetate content, 0.05-250 g/10 min in melt index(MI) (190 deg.C, 2,160 g load), <10 wt.% in acetonitrile solubles, and >=150,000 in weight-average molecular weight or >=3 wt.% in insolubles to benzene; wherein the component B is dispersed as islands each <=10μm in size in the component A as matrix. The other objective molded products and laminates each using the above resin composition are provided.
申请公布号 JP2001214072(A) 申请公布日期 2001.08.07
申请号 JP20000027516 申请日期 2000.02.04
申请人 NIPPON SYNTHETIC CHEM IND CO LTD:THE 发明人 IZUMI KOJI
分类号 C08J5/00;B32B27/28;C08L101/00;(IPC1-7):C08L101/00 主分类号 C08J5/00
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