| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered substrate, with which planar shrinkages are suppressed, improved in moisture resistance and capable of plating treatment as well. SOLUTION: Concerning this producing method for ceramic circuit board, plural green sheets composed of glass ceramic materials, containing organic binders and plastic materials formed with electrode patterns from conductor paste, are laminated and a substrate 1 is prepared by forming inorganic composition layers 1a and 1d, which are not sintered in the burning process of glass ceramic materials, on both or one principal surface of laminated green sheets. After the substrate 1 is burnt at a temperature capable of sintering the ceramic materials, glass materials are applied onto the surfaces of the inorganic composition layers 1a and 1d and the substrate is burnt again, at a temperature which is capable of sintering the glass materials. |
