| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wafer processing apparatus capable of reliably contacting a temperature measuring means for measuring the temperature of a wafer to the wafer. SOLUTION: The wafer processing apparatus is composed of a temperature measuring means 60 for measuring the temperature of a wafer 50, and a biasing means 62 for biasing the temperature measuring means 60 to the wafer 50 so that the temperature measuring means 60 contacts the surface of the wafer 50.</p> |
