发明名称 |
METHOD FOR DEPOSITING ELECTRO-MAGNETIC WAVE SHIELD FILM |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for depositing an electro-magnetic wave shield film on a non-conductive supporting body by using an electroplating technique. SOLUTION: The electro-magnetic wave shield film is deposited on an electrically non-conductive supporting body. At first, a thin metallic layer is deposited on the non-conductive supporting body by physical vapor deposition so as to apply the electroplating of one or more thick metallic layers on the thin metallic layer for providing an electro-magnetic wave shielding function and, preferably, an additional protecting function.
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申请公布号 |
JP2001200376(A) |
申请公布日期 |
2001.07.24 |
申请号 |
JP20000012191 |
申请日期 |
2000.01.20 |
申请人 |
HAKUTO KAGI KOFUN YUGENKOSHI |
发明人 |
RYU KEISHI;CHIN ZAIBOKU;KO KOSHO |
分类号 |
C25D5/12;C23C14/14;C23C14/20;C23C14/34;C23C28/02;C25D5/56;C25D7/00;H05K9/00;(IPC1-7):C23C28/02 |
主分类号 |
C25D5/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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