发明名称 METHOD FOR DEPOSITING ELECTRO-MAGNETIC WAVE SHIELD FILM
摘要 PROBLEM TO BE SOLVED: To provide a method for depositing an electro-magnetic wave shield film on a non-conductive supporting body by using an electroplating technique. SOLUTION: The electro-magnetic wave shield film is deposited on an electrically non-conductive supporting body. At first, a thin metallic layer is deposited on the non-conductive supporting body by physical vapor deposition so as to apply the electroplating of one or more thick metallic layers on the thin metallic layer for providing an electro-magnetic wave shielding function and, preferably, an additional protecting function.
申请公布号 JP2001200376(A) 申请公布日期 2001.07.24
申请号 JP20000012191 申请日期 2000.01.20
申请人 HAKUTO KAGI KOFUN YUGENKOSHI 发明人 RYU KEISHI;CHIN ZAIBOKU;KO KOSHO
分类号 C25D5/12;C23C14/14;C23C14/20;C23C14/34;C23C28/02;C25D5/56;C25D7/00;H05K9/00;(IPC1-7):C23C28/02 主分类号 C25D5/12
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