HEAT SEALING COMPOSITION, USE THEREOF AND CLOSURE PLUG MADE FROM SAID COMPOSITION

摘要

The invention concerns a heat sealing composition including an adhesive framework and a framework forming constituent, the adhesive constituent being a maleic vinyl-anhydride ethylene-acetate polymer or a vinyl ethylene-acetate polymer modified to have epoxy functions and the framework forming constituent being selected from among a block polyether amide, modified or not, and a block polyether ester. The composition is useful for making closure plugs.