| 摘要 |
A polyoxymethylene resin composition which comprises (A) a polyoxymethylene resin, (B1) a polyolefin resin on which a silicone compound has been grafted, and (B2) a silicone compound, wherein the amount of the silicone-grafted polyolefin resin (B1) is 0.05 to 10 parts by weight per 100 parts by weight of the polyoxymethylene resin (A) and the (B1)/(B2) weight ratio is from 99/1 to 70/30. The resin composition gives a molding having excellent sliding properties while retaining the thermal stability of the polyoxymethylene resin, gives a thin-wall molding greatly improved in release properties, and is prevented from deteriorating in sliding properties upon contact with a solvent, e.g., a dry-cleaning solvent. It is useful in applications such as electric/electronic parts, which are recently becoming smaller more and more, and in applications such as buckles, zippers, and clips.
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