发明名称 PRINTED WIRING BOARD CONNECTING METHOD AND CONNECTION STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a printed wiring board connecting method and a connection structure which improves the connection reliability and reduces cost. SOLUTION: Lands 13a of a conductor pattern 13, formed on a flexible printed wiring board 5 made of an insulation board material PEI, and the lands 11a of a conductor pattern formed on a ridged printed wiring board 2, are disposed close to each other through solder paste, connecting regions are heated over the glass transition temperature Tg of PFI, and an external pressure is applied to the connecting regions to electrically connect the lands 13a of the flexible wiring board 5 to the lands 11a of the ridged printed wiring board 2. A part of the insulation board material PEI of the flexible printed wiring board 5 is supplied to the electrical connections to seal the electric connections with PEI resin 15.
申请公布号 JP2001111209(A) 申请公布日期 2001.04.20
申请号 JP20000161822 申请日期 2000.05.31
申请人 DENSO CORP 发明人 KOJIMA KATSUAKI;MIYAKE TOSHIHIRO;IWAMA HIROYASU;TOTANI MAKOTO;YAZAKI YOSHITARO
分类号 H05K3/36;H05K1/14;(IPC1-7):H05K3/36 主分类号 H05K3/36
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