发明名称 COMPOSITE LIGHT EMITTING ELEMENT AND MANUFACTURE THEREOF
摘要 <p>PROBLEM TO BE SOLVED: To actualize the structure of a light emitting element, wherein light emitted by an active layer of the light emitting element having an active layer formed of a quaternary compound semiconductor InGaAlP is efficiently taken out, without being absorbed by a GaAs substrate, and its manufacturing method with a good non-defective rate. SOLUTION: A composite light emitting element is composed of a semiconductor light emitting element and a submount element 2, which electrically connects and mounts it in combination therewith. An active layer 8 is formed of InGaAlP and the semiconductor laminate structure has no GaAs included in surfaces up to a main light guide-out surface, and n-side and p-side electrodes 11 and 12 provide in the semiconductor light emitting element 1 are provided on the side of the mount surface on the submount element 2 to secure the light emission area of a main light guide-out surface, thereby increasing the light extraction efficiency.</p>
申请公布号 JP2001044502(A) 申请公布日期 2001.02.16
申请号 JP19990213295 申请日期 1999.07.28
申请人 MATSUSHITA ELECTRONICS INDUSTRY CORP 发明人 INOUE TOMIO;KOYA KENICHI;MURATA HIROSHI
分类号 H01L33/06;H01L33/30;H01L33/40;H01L33/62 主分类号 H01L33/06
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