Palladium surface coatings suitable for wirebonding and process for forming palladium surface coatings

摘要

A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN50) while at least one material layer has a hardness that is less than about 250 (KHN50).